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From: "Marvin Kaye" <marv@lancaironline.net>
Subject: Re: [LML] Re: MKII Elevator hinge
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Date: Wed, 31 Dec 2003 12:25:41 -0500
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Posted for "Charles R. Patton" <charles.r.patton@ieee.org>:

I concur with the technique of heating the aluminum, but with a small 
difference. I would use a heavy soldering iron or such directly applied to the 
aluminum in order to heat the hinge quickly without allowing the heat to soak 
into the underlying epoxy composite that the heat gun might do. Then sand off 
the exposed heat-affected bond layer. I removed many a copper printed circuit 
trace this way - sometimes intentionally.

Charles Patton
N360JM