X-Virus-Scanned: clean according to Sophos on Logan.com X-SpamCatcher-Score: 2 [X] Return-Path: Received: from [64.12.137.3] (HELO imo-m22.mail.aol.com) by logan.com (CommuniGate Pro SMTP 5.1.6) with ESMTP id 1857912 for flyrotary@lancaironline.net; Fri, 23 Feb 2007 10:00:24 -0500 Received-SPF: pass receiver=logan.com; client-ip=64.12.137.3; envelope-from=Lehanover@aol.com Received: from Lehanover@aol.com by imo-m22.mx.aol.com (mail_out_v38_r7.6.) id q.bd4.a500ff6 (39330) for ; Fri, 23 Feb 2007 09:59:22 -0500 (EST) From: Lehanover@aol.com Message-ID: Date: Fri, 23 Feb 2007 09:59:21 EST Subject: Re: [FlyRotary] Re: Cooked Board - Really! To: flyrotary@lancaironline.net MIME-Version: 1.0 Content-Type: multipart/alternative; boundary="-----------------------------1172242761" X-Mailer: 9.0 Security Edition for Windows sub 5359 X-Spam-Flag: NO -------------------------------1172242761 Content-Type: text/plain; charset="US-ASCII" Content-Transfer-Encoding: 7bit In a message dated 2/23/2007 9:22:24 A.M. Eastern Standard Time, eanderson@carolina.rr.com writes: From what little I read and I think I understand about the solder wave is that it is just to complex and hazardous for home use. A bed of liquid solder with "waves" agitated in it the cress of which bathes the component/pad. The reflow (put solder paste on the pads and cook in an IR oven) method seems to be the standard approach in industry at the moment. The cooking part worked fine, its the placement of components without rubbing the paste off the pad or disturbing other components already placed that is my challenge. Ed At Western Electric there were dozens of wave machines at the end of each circuit board line. Machines with belted devices inserted the devices, cut the leads to length and crimped the leads over the solder pad at the rate of a very fast machine gun. And that was in the 60s. Diodes, resistors and transistors went on this way. Other machines could add ICs and multiple lead devices in a similar way. I should have paid more attention. Lynn E. Hanover


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In a message dated 2/23/2007 9:22:24 A.M. Eastern Standard Time,=20 eanderson@carolina.rr.com writes:
<= FONT=20 style=3D"BACKGROUND-COLOR: transparent" face=3DArial color=3D#000000 size= =3D3>
From what little I read and I think I understand about the solder wav= e is=20 that it is just to complex and hazardous for home use.  A bed of liqu= id=20 solder with "waves" agitated in it the cress of which bathes the=20 component/pad.  
 
The reflow (put solder paste on the pads and cook in an IR oven) meth= od=20 seems to be the standard approach in industry at the moment.  The coo= king=20 part worked fine, its the placement of components without rubbing the past= e=20 off the pad or disturbing other components already placed that is my=20 challenge.
 
Ed
At Western Electric there were dozens of wave machines at the end of ea= ch=20 circuit board line. Machines with belted devices inserted the devices, cut t= he=20 leads to length and crimped the leads over the solder pad at the rate of a v= ery=20 fast machine gun. And that was in the 60s.
 
Diodes, resistors and transistors went on this way. Other machines coul= d=20 add ICs and multiple lead devices in a similar way. I should have paid more=20 attention.
 
Lynn E. Hanover



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