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On the first solder run, I had too much pressure and while
the area of the solder paste deposit was excellent (even on the 0.25mm socket
lands), there was too little quantity of solder to hold the hold the components
in position.
The second solder run I used less squeegee pressure and it
left (did not scope it out) a large volume of solder (too much in the case of
the 0.25mm socket lands and they bridged). Solder wick may be able to get
the excess solder out.
I have two more boards to experiment with - hopefully by
the end I will have it down.
Ed
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