Mailing List lml@lancaironline.net Message #2180
From: Merrill or Karen Smith <ksys@wwisp.com>
Subject: Bonding Material
Date: Mon, 5 Apr 1999 17:48:10 -0500
To: Lancair List <lancair.list@olsusa.com>
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Greetings All:

I need some suggestions for material to use for electrically bonding the
various components in my IV-P.  Sources for such materials would also be
appreciated.

Best regards,

Merrill Smith

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