Mailing List lml@lancaironline.net Message #10793
From: Marvin Kaye <marvkaye@olsusa.com>
Subject: splicing wires
Date: Mon, 20 Aug 2001 12:51:25 -0400
To: <lancair.list@olsusa.com>
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Posted for "Resonance Research" <DR.RESONANCE@next-wave.net>:

Ted

There is a problem with this type of splicing device.  The rosins in the solder are now trapped inside the connection and will start corroding the connection.  The rosins react with oxygen to begin the destructive process.  This may take a long time --- 5 or 10 years, but the corrosion with start eventually.  Not a good idea for aircraft quality connections.

Commercial printed circuit boards usually run through a tank to remove any excess rosins from the wave soldering process.  Skip this process and your boards will start corroding in a few years or less.  I know that most electronics people who solder usually skip this cleanup process but MIL SPEC soldering requires it as well as most PCB processes.  It's a bit like the "final straw that broke the camel's back" scenario.

It is best to use normal solder and then run a cloth over the connection.  The cloth is dipped into rosin cleaner or MEK which removes all excess rosin to prevent corrosion.

Best regards,

D.C. Cox


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